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1 ? fn6458.2 ISL54000, isl54001, isl54002 integrated audio amplifier systems the intersil ISL54000, isl54001, isl54002 family of devices are integrated audio power amplifier systems that combine stereo btl 8 amplifiers in a single package. the devices are designed to operate from a single +2.7v to +5v power supply. all devices are offered in a 20 ld 4x4 thin qfn package. targeted applications include handheld equipment such as cell-phones, mp3 player s, and games/toys. the ISL54000, isl54001, isl54002 parts contain two class ab bridge-tied (btl) type power amplifiers for driving stereo 8 speakers. each btl is capable of delivering 800mw (typ) with 0.4% thd+n and 941mw (typ) with 1% thd+n of continuous average power into an 8 btl speaker load when using a 5v supply. the isl54001 and isl54002 feature a 2:1 stereo input multiplexer front-end. this allows selection between two stereo sources. in addition the isl54002 has the capability of mixing the stereo inputs. all devices in this family feature low power shutdown, thermal overload protection and click/pop suppression. the click and pop circuitry eliminates audible transients during audio source changes and transitioning in and out of shutdown. features ? pb-free (rohs compliant) ? class ab 941mw stereo btl speaker amplifiiers ? single supply operation . . . . . . . . . . . . . . . . .+2.7v to +5.5v ? thd+n at 1khz, 800mw into 8 . . . . . . . . . . . . . . . . . .0.4% ? thd+n at 1khz, 941mw into 8 . . . . . . . . . . . . . . . . . . . 1% ? low power shutdown ? thermal shutdown protection ? ?click and pop? suppression circuitry ? 2:1 stereo input mux (isl54001, isl54002) ? mixing of two stereo inputs (isl54002) ? ttl logic-compatible ? available in 20 ld 4x4 thin qfn applications ? battery powered, handheld, and portable equipment - cellular/mobile phones - pda?s, mp3 players, dvd players, cameras - laptops, notebooks, palmtops - handheld games and toys ? desktop computers isl54002 typical application circuit and block diagram mux/mixer click and pop logic control bias thermal protection sd ins mix in 1r in 2r in 1l in 2l ref outr+ outr- outl+ outl- gnd v dd c ref micro controller right audio 1 right audio 2 left audio 1 left audio 2 btl btl 1f 0.1f 0.22f 0.22f 0.22f 0.22f mux/mixer data sheet october 17, 2007 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright intersil americas inc. 2007. all rights reserved all other trademarks mentioned are the property of their respective owners.
2 fn6458.2 october 17, 2007 pinouts ISL54000 (20 ld 4x4 tqfn) top view isl54001 (20 ld 4x4 tqfn) top view isl54002 (20 ld 4x4 tqfn) top view gnd nc in r nc nc v dd v dd gnd outr- ref outl- v dd gnd outl+ outr+ nc nc v dd sd in l 1 2 3 4 5 678910 15 14 13 12 11 20 19 18 17 16 gnd ins in 1r in 2r nc v dd v dd gnd outr- ref outl- v dd gnd outl+ outr+ nc in 2l v dd sd in 1l 1 2 3 4 5 678910 15 14 13 12 11 20 19 18 17 16 gnd ins in 1r in 2r mix v dd v dd gnd outr- ref outl- v dd gnd outl+ outr+ nc in 2l v dd sd in 1l 1 2 3 4 5 678910 15 14 13 12 11 20 19 18 17 16 pin descriptions pin name function ISL54000 isl54001 isl54002 3, 6, 8, 12 3, 6, 8, 12 3, 6, 8, 12 v dd system power supply 4, 9, 20 4, 9, 20 4, 9, 20 gnd ground connection 11 - - in l left channel audio input 1 -1111 in 1l left channel audio input 1 -1313 in 2l left channel audio input 2 17 - - in r right channel audio input 1 -1717in 1r right channel audio input 1 -1919in 2r right channel audio input 2 2 2 2 outl+ positive speaker output 5 5 5 outr+ positive speaker output 1 1 1 outl- negative speaker output 7 7 7 outr- negative speaker output 14 14 14 sd shutdown, high to disable amplifiers, low for normal operation. - 18 18 ins input select - - 16 mix mixer, high to mix right and left audio inputs, low to pass audio inputs without mixing 10 10 10 ref common-mode bias voltage, bypass with a 1f capacitor to gnd 13, 15, 16, 18, 19 15, 16 15 nc no connect ISL54000, isl54001, isl54002
3 fn6458.2 october 17, 2007 ordering information part number part marking temp. range (c) package (pb-free) tape & reel pkg. dwg. # ISL54000irtz* (note) 540 00irtz -40 to +85 20 ld 4x4 tqfn (pb-free) l20.4x4a isl54001irtz* (note) 540 01irtz -40 to +85 20 ld 4x4 tqfn (pb-free) l20.4x4a isl54002irtz* (note) 540 02irtz -40 to +85 20 ld 4x4 tqfn (pb-free) l20.4x4a *add ?-t? suffix for tape and reel. please refer to tb347 for details on reel specifications. note: these intersil pb-free pl astic packaged products employ special pb-free material sets; molding compounds/die attach materials and 100% matte tin plate plus anneal - e3 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-f ree products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. ISL54000 truth table sd outr+ outr- outl+ outl- 1 disabled disabled disabled disabled 0in r in r in l in l isl54001 truth table sd ins outr+ outr- outl+ outl- 1 x disabled disabled disabled disabled 00 in 1r in 1r in 1l in 1l 01 in 2r in 2r in 2l in 2l isl54002 truth table sd mix ins outr+ outr- outl+ outl- 1 x x disabled disabled disabled disabled 000 in 1r in 1r in 1l in 1l 001 in 2r in 2r in 2l in 2l 01x in 1r + in 2r in 1r + in 2r in 1l + in 2l in 1l + in 2l ISL54000, isl54001, isl54002
4 fn6458.2 october 17, 2007 absolute maximum rati ngs thermal information vdd to gnd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to +6.5v input voltages in_r, in_l, sd, ins, mix . . . . . . . . . . . . . . -0.3v to (vdd + 0.3v) output voltages out_+, out_-. . . . . . . . . . . . . . . . . . . . . . -0.3v to (vdd + 0.3v) continuous current (vdd, out_, gnd) . . . . . . . . . . . . . . . . 750ma esd rating human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .> 2kv machine model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .> 200v charged device model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .> 1kv operating conditions temperature range . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +85c thermal resistance (typical, notes 1, 2) ja (c/w) jc (c/w) 20 ld 4x4 tqfn package . . . . . . . . . . 45 6.5 maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . +150c maximum storage temperature range . . . . . . . . . . . -65c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 1. ja is measured in free air with the component mounted on a high ef fective thermal conductivity test board with ?direct attach? fe atures. jc, the ?case temp? is measured at the center of the exposed me tal pad on the package underside. see tech brief tb379. 2. for jc , the ?case temp? location is the center of the exposed metal pad on the package underside. electrical specifications - 5v supply test conditions: v dd = +5v, gnd = 0v, v inh = 2.4v, v inl = 0.8v, sd = mix = ins = v inl , c ref = 1f, r l is terminated between out_+ and out_ -, unless otherwise specified (note 3). parameter test conditions temp (c) min (notes 4, 5) typ max (notes 4, 5) units general power supply range, v dd full 2.7 - 5.5 v quiescent supply current, i dd ins = mix = v inl or v inh , r l = none , inputs ac coupled to ground (0.1f) 25 - 4.6 12 ma full - 5.5 - ma shutdown supply current, i sd sd = v inh , ins = mix = v inl or v inh , r l = 8 ( btl ), inputs ac coupled to ground (0.1f) 25 - 28 50 a full - 31 - a input resistance, r in ins = 0v or v dd 25 - 100 - k thermal shutdown, t sd ins = mix = 0v or v dd 25 - 150 - c thermal shutdown hysteresis 25 - 10 - c sd to full operation, t sd(on) ins = 0v or 5v, mix = 0v or 5v full - 1 - ms btl amplifier driver output offset voltage, v os measured out_+ and out_-, input ac coupled to ground (0.1f) 25 - 38 - mv full - 49 - mv power supply rejection ratio, psrr v ripple = 200mv p-p , r l = 8 , input ac coupled to ground (0.1f) f ripple = 217hz 25 - 49 - db f ripple = 1khz 25 - 47 - db output power, p out r l = 8 , thd + n = 1%, f = 1khz 25 - 941 - mw r l = 8 , thd + n = 10%, f = 1 khz 25 - 1.23 - w total harmonic distortion + noise, thd + n r l = 8 , p out = 800mw, f = 1khz 25 - 0.4 - % r l = 8 , p out = 800mw, f = 20hz to 20khz 25 - 0.7 - % max output voltage swing, v out r l = 8 , v signal = 5v p-p , f = 1khz 25 7.2 7.7 - v p-p signal to noise ratio, snr r l = 8 , p out = 900mw, f = 1khz 25 - 85 - db output noise, n out a - weight filter, bw = 22hz to 22khz 25 - 125 - v rms ISL54000, isl54001, isl54002
5 fn6458.2 october 17, 2007 crosstalk r ch to l ch , l ch to r ch r l = 8 , p out = 800mw, f = 1khz, signal coupled from the input of active amplifier to the output of an adjacent amplifier with its input ac coupled to ground. 25 - 80 - db off-isolation sd = v inh, p out = 800mw, f = 10khz, signal coupled from input to output of a disabled amplifier. 25 - 130 - db channel gain matching r ch to l ch r l = 8 , vinxr = vinxl = 3.88v p-p (connect to the same source) 25 - +-0.1 - db channel phase matching r ch to l ch r l = 8 , vinxr = vinxl = 3.88v p-p (connect to the same source) 25 - 0.01 - logic input input leakage current, i sd , i ins , i mix v dd = 5v, sd = 0v, ins = 0v, mix = 0v 25 -3 1.9 3 a full - 1.9 - a input leakage current, i sd , i ins , i mix v dd = 5v, sd = v dd , ins = v dd , mix = v dd 25 -1 0.02 -1 a full - 0.02 - a v inh full 2.4 - - v v inl full - - 0.8 v electrical specifications - 3.6v supply test conditions: v dd = +3.6v, gnd = 0v, v inh = 1.4v. v inl = 0.4v, sd = mix = ins = gso = gs1 = v inl , c ref = 1f. r l is terminated between out_+ and out_ -, unless otherwise specified (note 3). parameter test conditions temp (c) min (notes 4, 5) typ max (notes 4, 5) units general quiescent supply current, i dd ins = 0v or v dd , mix = 0v or v dd , r l = none , input ac coupled to ground (0.1f) 25 - 2.7 12 ma full - 3 - ma shutdown supply current, i sd ins = 0v or v dd , mix = 0v or v dd , r l = 8 ( btl ), input ac coupled to ground (0.1f) 25 - 13 50 a full - 15 - a btl amplifier driver, hd = v inh, ho = v inh, unless otherwise specified output offset voltage, v os measured between out_+ and out_-, input ac coupled to ground (0.1f) 25 - 25 - mv full - 40 - mv power supply rejection ratio, psrr v ripple = 200mv p-p , r l = 8 , input ac coupled to ground (0.1f) f ripple = 217hz 25 - 49 - db f ripple = 1khz 25 - 47 - db output power, p out r l = 8 , thd + n = 1%, f = 1khz 25 - 310 - mw r l = 8 , thd + n = 10%, f = 1khz 25 - 528 - mw total harmonic distortion + noise, thd + n r l = 8 , p out = 200mw, f = 1khz 25 - 0.4 - % r l = 8 , p out = 200mw, f = 20hz to 20khz 25 - 0.4 - % max output voltage swing, v out r l = 8 , v signal = 3.6v p-p , f = 1khz 25 - 5.8 - v p-p logic input input leakage current, i sd , i ins , i mix v dd = 5v, sd = 0v, ins = 0v, mix = 0v 25 -3 1.9 3 a full - 1.9 - a electrical specifications - 5v supply test conditions: v dd = +5v, gnd = 0v, v inh = 2.4v, v inl = 0.8v, sd = mix = ins = v inl , c ref = 1f, r l is terminated between out_+ and out_ -, unless otherwise specified (note 3). (continued) parameter test conditions temp (c) min (notes 4, 5) typ max (notes 4, 5) units ISL54000, isl54001, isl54002
6 fn6458.2 october 17, 2007 ISL54000 typical application circuit and block diagram input leakage current, i sd , i ins , i mix v dd = 5v, sd = v dd , ins = v dd , mix = v dd 25 -1 0.02 1 a full - 0.02 - a v inh full 1.4 - - v v inl full - - 0.4 v notes: 3. v in = input voltage to perform proper function. 4. the algebraic convention, whereby the most negative value is a minimum and the most pos itive a maximum, is used in this data sheet. 5. parts are 100% tested at +25c. over-temperature limits established by charac terization and are not production tested. electrical specifications - 3.6v supply test conditions: v dd = +3.6v, gnd = 0v, v inh = 1.4v. v inl = 0.4v, sd = mix = ins = gso = gs1 = v inl , c ref = 1f. r l is terminated between out_+ and out_ -, unless otherwise specified (note 3). (continued) parameter test conditions temp (c) min (notes 4, 5) typ max (notes 4, 5) units click and pop logic control bias thermal protection sd in r in l ref outr+ outr- outl+ outl- gnd v dd c ref micro controller right audio btl btl left audio 1f 0.1f 0.22f 0.22f ISL54000, isl54001, isl54002
7 fn6458.2 october 17, 2007 isl54001 typical application circuit and block diagram isl54002 typical application circuit and block diagram mux mux click and pop logic control bias thermal protection sd ins in 1r in 2r in 1l in 2l ref outr+ outr- outl+ outl- gnd v dd c ref micro controller right 1 audio right 2 audio left 1 audio left 2 audio btl btl 1f 0.1f 0.22f 0.22f 0.22f 0.22f mux/mixer logic control bias sd ins mix in 1r in 2r in 1l in 2l ref outr+ outr- outl+ outl- gnd v dd c ref micro controller blt blt 1f 0.1f 0.22f 0.22f 0.22f 0.22f mux/mixer right 1 audio right 2 audio left 1 audio left 2 audio click and pop thermal protection ISL54000, isl54001, isl54002
8 fn6458.2 october 17, 2007 detailed description the intersil ISL54000, isl54001, isl54002 family of devices are integrated audio power amplifier systems designed to drive 8 speaker loads. they ca n operate with a supply voltage of +2.7v to +5v and provide good quality audio, while requiring minimal external components. its low 0.4% thd+n while driving 800mw into an 8 speaker ensures clean, low distortion amplification of the audio signals. the devices are offered in a 20 ld 4x4 tqfn package. targeted applications include handheld equipment such as cell-phones, mp3 players, and games/toys. the ISL54000, isl54001, isl54002 parts contain two class ab bridge-tied (btl) type power amplifiers for driving stereo 8 speakers. when powered with a 5v supply, each btl is capable of delivering 941mw (typ) of continuous average power to an 8 speaker load with 1% thd+n performance. when the speaker load is co nnected across the positive and negative terminals of the btl dr iver, the voltage is doubled across the load and the power is quadrupled. the isl54001 and isl54002 feat ure a 2:1 stereo input multiplexer front-end. this allows selection between two stereo sources. the ins contro l pin determines which stereo input is active. applying a l ogic ?0? to the ins control pin selects stereo input 1 (r 1 and l 1 ). applying a logic ?1? to the ins control pin selects stereo input 2 (r 2 and l 2 ). the isl54002 has the capability of mixing the two stereo inputs. when in mix mode (mix = ?1?) the isl54002 mixes the r 1 input with the r 2 input and sends the combined signal to the outr_ btl driver and it mixes the l 1 input with the l 2 input and sends the combined signal to the outl_ btl driver. all devices in this family feature low power shutdown, thermal overload protection and click/pop suppression. the click and pop circuitry prohibits switching between input channels until the audio input signals are at their lowest point, which eliminates audible transients in the speakers when changing audio input sources. the click/pop circuitry also keeps speaker transients to an inaudibile level when entering and leaving shutdown. typical application circuits and block diagrams for each device in the family are on page 6 and 7. dc bias voltage the ISL54000, isl54001, isl54002 have internal dc bias circuitry, which dc offsets the incoming audio signal at v dd /2. when using a 5v supply, the dc offset will be 2.5v. when using a 3.6v supply, the dc offset will be 1.8v. since the signal gets biased internally at v dd /2, the audio signals need to be ac coupled to the inputs of the device. the value of the ac coupling capacitor depends on the low frequency range required for the application. a capacitor of 0.22 f will pass a signal as low as 7.2hz. the formula required to calculate the capacitor value is shown in equation 1: the 100k is the impedance looking into the input of the ISL54000, isl54001, and isl54002 devices. btl speaker amplifiers the ISL54000, isl54001, and isl54002 contain two bridge-tied load (btl) amplifie rs designed to drive a speaker load differentially. the output from one btl is outl+ and outl-. the output of the other btl is outr+ and outr-. a single btl driver consists of inverting and non-inverting power op amps. the ac signal out of each op amp are equal in magnitude but 180 out-of-p hase, so the ac signal at outl+ and outl- have the same amplitude but are 180 out-of-phase. the same is true of outr+ and outr-. the speaker load gets connected between the + terminal and - terminal outputs. driving the load differentially using a btl configuration doubles the output voltage across the speaker load and quadruples the power to the load. in effect you get a gain of two due to this configuration at the load as compared to driving the load with a single-ended amplifier with its load connected between a single am plifier?s output and ground. the outputs of each btl are biased at v dd /2. when the load gets connected across the + and - terminal of the btl, the mid supply dc bias vo ltage at each output gets cancelled out eliminating the need for large bulky output coupling capacitors. low power shutdown with a logic ?1? at the sd control pin the device enters the low power shutdown state. w hen in shutdown the output amplifiers go into an high impedance state and supply current is reduced to 26 a (typ). in shutdown mode before the amplifiers enter the high impedance/low current drive stat e, the bias voltage of v dd /2 remains connected at the output through a 100k resistor. this resistor is not present during active operation of the drivers but gets switched in when the sd pin goes high and disconnected when the sd pin goes low. leaving the dc bias voltage connected through this 100k resistor reduces the transient that is generated across the speaker, while going into or out of shutdown, to a level that does not produce clicking or popping in the speaker. qfn thermal pad considerations the qfn package features an exposed thermal pad on its underside. this pad lowers the package?s therma l resistance by providing a direct heat conduct ion path from the die to the pcb. connect the exposed thermal pad to gnd by using a (eq. 1) c 1 6.28 f 100k ? ? ? ISL54000, isl54001, isl54002
9 fn6458.2 october 17, 2007 large copper pad and multiple vias to the gnd plane. the vias should be plugged and tented with plating and solder mask to ensure good thermal conductivity. best thermal performance is achieved with the largest practical copper ground plane area. pcb layout consider sations and power supply bypassing to maintain the highest load dissipation and widest output voltage swing the power supply pcb traces and the traces that connect the output of t he drivers to the speaker loads should be made as wide as possible to minimize losses due to parasitic trace resistance. proper supply bypassing is necessary for high power supply rejection and low noise performance. a filter network consisting of a 10f capacitor in parallel with a 0.1f capacitor is recommended at the voltage regulator that is providing the power to the ISL54000, isl54001, and isl54002 ic. local bypass capacitors of 0. 1f should be put at each v dd pin of the ISL54000, isl54001, isl54002 devices. they should be located as close as possible to the pin, keeping the length of leads and traces as short as possible. a 1f capacitor from the ref pin (pin 10) to gnd is needed for optimum psrr and internal bias voltage stability. typical performance curves t a = +25c, unless otherwise specified. figure 1. thd+n vs frequency figure 2. thd+n vs frequency figure 3. thd+n vs output power figure 4. thd+n vs output power thd+n (%) frequency (hz) 0.1 1.0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 20 20k 50 100 200 500 1k 2k 5k 10k v dd = 5v btl r l = 8 p o = 800mw thd+n (%) frequency (hz) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 20 20k 50 100 200 500 1k 2k 5k 10k v dd = 3.6v btl r l = 8 p o = 200mw 1.0 thd+n (%) output power (w) 0.01 10.0 0.02 0.05 0.10 0.20 0.50 1.00 2.00 5.00 10m 1 20m 50m 100m 200m 500m v dd = 5v btl r l = 8 f = 1khz thd+n (%) output power (w) 0.01 10.0 0.02 0.05 0.10 0.20 0.50 1.00 2.00 5.00 10m 600m 20m 40m 70m 100m 200m v dd = 3.6v btl r l = 8 f = 1khz ISL54000, isl54001, isl54002
10 fn6458.2 october 17, 2007 figure 5. crosstalk vs frequency figu re 6. offisolation vs frequency figure 7. psrr vs frequency figure 8. power dissipation vs output power figure 9. power dissipation vs output power die characteristics substrate potential (powered up): gnd process: submicron cmos typical performance curves t a = +25c, unless otherwise specified. (continued) crosstalk (db) frequency (hz) -120 -40 -115 -110 -105 -100 -95 -90 -85 -80 -75 -70 -65 -60 -55 -50 -45 20 20k 50 100 200 500 1k 2k 5k 10k r ch to l ch l ch to r ch v dd = 5v p o = 800mw v dd = 5v p o = 800mw offisolation (db) frequency (hz) -160 -80 -155 -150 -145 -140 -135 -130 -125 -120 -115 -110 -105 -100 -95 -90 -85 20 20k 50 100 200 500 1k 2k 5k 10k psrr (db) frequency (hz) -70 -20 -68 -66 -64 -62 -60 -58 -56 -54 -52 -50 -48 -46 -44 -42 -40 -38 -36 -34 -32 -30 -28 -26 -24 -22 10 20k 20 50 100 200 500 1k 2k 5k 10k v dd = 5v btl v ripple = 200m v p-p p out (mw) power dissipation (mw) 0 100 200 300 400 500 600 700 0 250 500 750 1000 v dd = 5v btl r l = 8 p out (mw) power dissipation (mw) 0 50 100 150 200 250 300 350 400 0 100 200 300 400 500 v dd = 3.6v btl r l = 8 ISL54000, isl54001, isl54002
11 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6458.2 october 17, 2007 ISL54000, isl54001, isl54002 thin quad flat no-lead plastic package (tqfn) thin micro lead fr ameplastic package (tmlfp) l20.4x4a 20 lead quad flat no-lead plastic package (compliant to jedec mo-220wggd-1 issue i) symbol millimeters notes min nominal max a 0.70 0.75 0.80 - a1 - 0.02 0.05 - a2 - 0.55 0.80 9 a3 0.20 ref 9 b 0.18 0.25 0.30 5, 8 d 4.00 bsc - d1 3.75 bsc 9 d2 1.95 2.10 2.25 7, 8 e 4.00 bsc - e1 3.75 bsc 9 e2 1.95 2.10 2.25 7, 8 e 0.50 bsc - k0.20 - - - l 0.35 0.60 0.75 8 n202 nd 5 3 ne 5 3 p- -0.609 --129 rev. 0 11/04 notes: 1. dimensioning and tolerancing conform to asme y14.5-1994. 2. n is the number of terminals. 3. nd and ne refer to the number of terminals on each d and e. 4. all dimensions are in millimeters. angles are in degrees. 5. dimension b applies to the meta llized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. the configuration of the pin #1 identifier is optional, but must be located within the zone indicated. the pin #1 identifier may be either a mold or mark feature. 7. dimensions d2 and e2 are fo r the exposed pads which provide improved electrical and thermal performance. 8. nominal dimensions are provided to assist with pcb land pattern design efforts, see intersil technical brief tb389. 9. features and dimensions a2, a3, d1, e1, p & are present when anvil singulation method is used and not present for saw singulation.

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